The year 2024 is just one and a half months away now. As the 2024 closes in, the launch of the Samsung Galaxy S24 series also comes closer. Between the period of January to February, Samsung could launch its next-gen flagship series. This could most likely include three models; the Galaxy S24, the Galaxy S24 Plus, and the Galaxy S24 Ultra. The upcoming Samsung flagship series is expected to launch with so many new features. AI might play a major role. However, in the latest leak, the Samsung Galaxy S24 series is expected to debut with enhanced performance. Let’s talk about it.
The Samsung Galaxy S24 series is expected to feature FOWLP, paired with next-gen processors. This will help the devices to perform even faster and effectively.
Also read: Here’s how Samsung Galaxy S24 Ultra could look: Renders reveal
FOWLP stands for Fan-Out Wafer Level Packaging. This is an important packaging technology that helps in semiconductor integration. FOWLP is a fine process of packaging. It keeps the chips directly connected to the silicon wafer. Furthermore, with this packaging, the chips are smaller, thinner, and even perform well.
According to a report by Korean Daily, Samsung has started the mass production of FOWLP. This new packaging technology is expected to be used in the latest Exynos 2400 chipset, as per a report by Forbes. The same chipset might power the Samsung Galaxy S24 and Galaxy S24 Plus.
Also read: Samsung Galaxy S24 & S24 Ultra appear on Geekbench: Here’s what to expect
We all know Samsung’s Exynoss chipsets are not doing well, as compared to Qualcomm’s chipsets. In that aspect, FOWLP could be Samsung’s knight in shining armour because the brand wants its own efficient chipsets. If this works out well, Samsung might launch the Galaxy S24 and Galaxy S24 Plus with Exynoss 2400 SoC made by FOWLP.
Speaking of the Samsung Galaxy S24 Ultra, this will most likely be powered by the Snapdragon 8 Gen 3 for Galaxy processor.
