The Exynos 9810 SoC is manufactured on 2nd generation 10nm process and comes with Samsung’s custom CPU cores.
Samsung has unveiled its next-generation processor, the Exynos 9810 SoC. While the company touts the fact that its Exynos 9810 won awards at CES 2018, not much has been revealed about the chip’s features yet.
The Exynos 9810 is based on Samsung's custom-core design called Mongoose, with 3rd-generation CPU cores and an “upgraded” GPU, which will most likely be the Mali-G72. The processor features Samsung’s latest Category 18 LTE modem, which combines 6 carriers (6CA support) for data speeds of up to 1.2Gbps. Company's next chipset was expected to be manufactured using a 7nm process, however the Exynos 9810 is manufactured using the company's 2nd generation 10nm FinFET process.
Apart from Samsung's own processors, the company has reportedly purchased almost the entire first batch of Qualcomm's Snapdragon 845 chipsets for its next year flagship, the Galaxy S9. The Galaxy S9 is rumoured to feature a design similar to the Galaxy S8 and S8 Plus. A report also states that the smartphone will feature a fingerprint sensor on its rear panel as opposed to the under display fingerprint sensor it was previously expected to come with.
Samsung is not completely giving up on the under display fingerprint recognition technology, as a previous report said that it will debut first on the Galaxy Note 9. Earlier, a report by KGI Securities had suggested that instead of the Galaxy S9, the Galaxy Note 9 will be the first Samsung smartphone to feature an under display fingerprint sensor.
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Shubham Sharma
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