Samsung Galaxy S9 spotted on Geekbench, could come with heat pipes for cooling

Updated on 20-Nov-2017
HIGHLIGHTS

The Samsung Galaxy S9 could be powered by the company’s latest Exynos 9810 Octa-core SoC and run on 4GB RAM. It is also expected to come with face recognition technology and feature heat pipes for cooling.

Samsung’s 2018 flagship smartphone, the Galaxy S9 has been spotted on Geekbench. As per the listing, the device is powered by the company’s own Exynos 9810 Octa-core processor. A report by Android Headlines states that the production of heat pipes for the Samsung Galaxy S9 and the Galaxy Note 9 smartphones have already started.

The Geekbench listing of the Galaxy S9 reveals that the smartphone features 4GB of RAM and runs on Android 8.0 Oreo. Even though the device was spotted running on an Exynos chip, a previous report tipped that the smartphone could also launch in a variant running Qualcomm's Snapdragon 845 SoC. Samsung has reportedly purchased the entire first batch of the Snapdragon 845 chipset for the Galaxy Note 9.

 

Samsung is also expected to launch a mini model of the Galaxy S9 next year alongside the Galaxy S9 and the Galaxy S9+. The Galaxy S9 Mini is expected to feature a smaller 5-inch display with curved edges. Previous reports suggest that the Samsung Galaxy S9 may miss out on the under display fingerprint sensor, but it is rumoured to come with facial recognition technology similar to the iPhone X.

The Exynos 9810 SoC was quietly revealed by Samsung recently. As mentioned earlier, the chipset is based on the company’s custom-core design called Mongoose, with 3rd-generation CPU cores. It also features an “upgraded” GPU, which is most likely the Mali-G72. Samsung’s next SoC was expected to be manufactured using a 7nm process, however, the Exynos 9810 is manufactured using the company's 2nd generation 10nm FinFET process. You can read more about the new Exynos 9810 SoC here.

Digit NewsDesk

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