Global chip-maker Qualcomm is likely to launch its mid-range Snapdragon 670 chipset in the first half of 2018, reports say. The new SoC is expected to bring improvements to mid-range smartphone imaging
"Qualcomm testing new Snapdragon 670 (SDM670) — their test platform has 4/6 GB LPDDR4X RAM, 64 GB eMMC, 5.1 flash storage, WQHD screen, 22.6 + 13 MP camera," Roland Quandt, a famed and highly-accurate leakster, tweeted. Here, Quandt is talking about a prototype device used for testing the Snapdragon 670 chipset.
The mid-range processor from the California-based tech giant will be reportedly manufactured using Samsung's 10-nanometer (nm) LPP process technology.
This is the same technology that was behind Snapdragon 835 and Exynos 8895 chips that powered flagships devices like Samsung Galaxy S8, OnePlus 5T, Pixel 2XL and HTC U11 this year.
Succeeding Snapdragon 660, Snapdragon 670 is expected to go into mass production in the first quarter of 2018, according to Gizmo China. On paper, the Qualcomm Snapdragon 660 SoC can support up to 16MP dual camera sensors or up to 24MP single camera lens. The Snapdragon 670 is expected to bring improvements to the imaging department and the prototype device allegedly housing the chipset supports a 22.6MP + 13 MP dual rear camera setup, which is likely to be higher on a final unit once the chipset is made official. The Snapdragon 660 SoC featured eight Kyro 260 cores clocked at 2.2GHz and the 670 is expected to retain the Octa-core configuration.
Earlier this month, the chipset maker unveiled the next-generation Snapdragon 845 processor at the annual Snapdragon Technology Summit in Hawaii. The 845 mobile platform is a successor to 2016's Snapdragon 835 and will drive improved performance, better power efficiency, and improved image processing. The processor will likely come in many high-end Android phones in 2018.
With inputs from Digit NewsDesk