The specifications of Qualcomm's next flagship SoC have been leaked
Tipped to be called the Snapdragon 875, the chipset is said to be based on the 5nm process
The SoC is also tipped to come with the new X60 5G modem
Qualcomm’s new Snapdragon 865 flagship SoC has barely entered the market and now it looks like the specs of its successor have already been leaked. 91mobiles claims to have gotten an email from a reader that is said to detail the specifications of the upcoming chipset. The report by the website claims that the chipset will have the codename SM8350 and will be based on the 5nm process, and maybe manufactured by TSMC.
Specifications of the Snapdragon 875, according to the leak:
- Kryo 685 CPU built on Arm v8 Cortex tech
- 3G/ 4G/ 5G modem –Millimeter wave (mmWave) and sub-6 GHz bands
- Adreno 660 GPU
- Adreno 665 VPU
- Adreno 1095 DPU
- Qualcomm Secure Processing Unit (SPU250)
- Spectra 580 image-processing engine
- Snapdragon Sensors Core Technology
- External 802.11ax, 2×2 MIMO, and Bluetooth Milan
- Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator
- Quad-channel package-on-package (PoP) high-speed LPDDR5 SDRAM
- Low-power audio subsystem combined with Aqstic Audio Technologies WCD9380 and WCD9385 audio codec
The report also notes that the Snapdragon 875 will pack the new X60 5G modem, but isn’t sure if it will be integrated into the SoC, or will be an option. Further, if it is fabricated using the 5nm process, one can expect significant performance improvements as well as energy efficiency. As for the launch date, Qualcomm usually unveils its chips sometime in December, so one can expect it to be unveiled during that time. However, with the ongoing COVID-19 Coronavirus pandemic, the launch might be pushed to sometime in early 2021. Of course, as with any leaks, its best it takes all this with a pinch of salt till the company makes a formal announcement.
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