MediaTek has announced a new SoC in the 7000 series which is a 4nm chipset and is called the MediaTek Dimensity 7200. The company claims that it will help with a better gaming experience and photography performance and it will be seen rolling out in smartphones in the first quarter of 2023.
The Dimensity 7200 is placed just below Dimensity 8000 series which is used in mid-range phones and some flagship phones as well. So the MediaTek Dimensity 7200 might be rolling out in mid-range smartphones. The chipset is built on the 4nm processor just like the flagship MediaTek Dimensity 9200. \
The Mediatek Dimensity 7200 is equipped with an octa-core CPU, consisting of two Cortex-A715 cores clocked at 2.8GHz and six Cortex-A510 cores at an unknown frequency. The chipset is also equipped with an Arm Mali-G610 MC4 GPU.
The other features of the Dimensity 7200 are APU 650 machine learning silicon, a Release 16 sub-6GHz 5G modem, support for 144Hz refresh rates at FHD+ display resolutions, AI-based variable-rate shading, Bluetooth 5.3, and Wi-Fi 6E support.
The Mediatek Dimensity also supports cameras up to 200-megapixel, 4K videos simultaneous dual video capture and motion-compensated noise reduction in low light.
The Dimensity 7200 will support 32-bit apps because of fewer CPU cores, confirmed Mediatek to Android Authority.
“The MediaTek Dimensity 7000 series will be vital for mobile gamers and photography enthusiasts who are looking for an affordable way to squeeze the most battery life out of their phones without skimping on performance,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.