Many smartphone manufacturers are working on a foldable/bendable phone but apart from prototypes and reports, there is nothing much to go on on. However, the tipster @bang_gogo_ has tweeted out a hands-on video of Lenovo’s foldable phone, which seems to be still under development. The video reveals a phone that quite tall but can be folded and is still perfectly operational with the touchscreen still working. However, the device doesn’t exactly fold flat and there is a curve around its spine from where it bends, reminding us of the Microsoft Surface Book 2’s hinge.
The video reveals the device’s thick bezels on the top and bottom, and the soft navigation keys are also present. There is also a black spot on the center-right edge of the display, which seems like an issue with the prototype rather than the technology. It is quite similar to the Cplus flexible prototype phone that the company showed off at the Tech World Conference back in 2016. The CPlus wrapped around a user’s wrist like a watch but the leaked phone in the new video seems like an actual phone. The CPlus came equipped with a 4.35-inch AMOLED screen and a real leather back.
https://twitter.com/bang_gogo_/status/1044934487404994561?ref_src=twsrc%5Etfw
Apart from Lenovo, there are other smartphone makers like Samsung and Huawei that have confirmed of working on a foldable/bendable phone. During an interview, CEO of Samsung’s Mobile Division, DJ Koh confirmed that the company is working on a smartphone with foldable display and its called the Galaxy F. Koh had also hinted that more details of the device could be unveiled this year at the Samsung Developer Conference that will take place from November 7-8 in San Francisco.
Apple and Huawei are also reportedly working on smartphones with foldable displays. As per an earlier report, Apple might launch a foldable iPhone in 2020 that could potentially double up as a tablet but Huawei is reportedly looking to launch the device by the end of 2018. The company had filed the patent for a foldable phone at WIPO (World Intellectual property Organization).