CES 2016: LeTV’s Le Max Pro becomes first phone on Qualcomm’s Snapdragon 820
The phone comes with a large 6.33-inch WQHD display and a 21MP rear camera with a fingerprint sensor located just below it.
Qualcomm’s newest flagship SoC, the Snapdragon 820, finally has a device to its name. It seems Chinese manufacturer Letv's Le Max Pro smartphone is going to be the first smartphone to be powered by this SoC. The phone was unveiled at the CES event in Las Vegas and comes with Qualcomm’s Sense ID fingerprint technology. This technology uses an ultrasonic biometric sensor which, unlike optical technology, can read fingerprints through a layer of glass or metal. The phone comes with a massive 6.33-inch display with a WQHD resolution of 2560 x 1440 pixels. At the back is a 21MP camera with a fingerprint sensor located just below it. The device runs Android Marshmallow v6.0 and will be available in 32GB, 64GB, 128GB variants. The phone also comes with a 3400mAh battery with Quick Charge 2.0 and a USB Type-C port.
It was earlier speculated that the Samsung Galaxy S7 would be the first to come with the Snapdragon 820 processor. Rumours had also said that the South Korean manufacturer would have exclusive rights to the SoC till April this year. The Galaxy S7 has been tipped to come in two variants, one would be powered by a Snapdragon 820, while the other would run the Exynos 8890 processor. Samsung is expected to announce the device during the Mobile World Congress event, scheduled to be held in Barcelona next month. On the other hand, Chinese Xiaomi’s next flagship device, the Xiaomi Mi 5, has also been tipped to be powered by the Snapdragon 820 SoC. However, Xiaomi CEO, Lei Jun has stated that the company is not going to rush the Mi 5 just to match the first wave of smartphones powered by the SoC. He said the the aim is to “put greater importance on the user experience and mass production, rather than being first.”
Qualcomm had officially announced the SoC in November, 2015. The Snapdragon 820 is based on a 14nm FinFET fabrication process with four custom CPU cores. Qualcomm claims that the new CPU has twice the performance and efficiency as compared to the Snapdragon 810.