Apple iPhone 8 3D renders leak shows vertical camera setup, edge-to-edge design
The Apple iPhone 8 is expected to be showcased at company's fall event, but might get delayed due to supply constraints
Apple's anniversary edition iPhone, dubbed the iPhone 8, has been part of multiple leaks in the past. The handset is expected to be announced at company's fall event in September, but most analysts believe that it won't be available for purchase for at least till the end of this year due to supply constraints and limitations with developing the 3D sending camera system.
According to new renders posted by MySmartPrice in collaboration with OnLeaks, the handset will sport an edge-to-edge OLED display and vertically placed dual camera module for augmented reality applications. These new renders match the ones that leaked in the past and are reportedly based on factory CAD designs. The renders suggest that the device will sport an edge-to-edge OLED display with stainless steel casing and glass back. There are also no signs of a home button, hinting at chances of Apple incorporating the touch sensor within the display. There are also rumours that next generation iPhone's Touch ID will be embedded inside the Apple logo.
The handset is said to measure 143.5 x 70.9 x 7.7mm in dimensions and 8.9mm in thickness including the rear camera bump. Apple is reportedly testing multiple designs for its anniversary edition model and OnLeaks says he is not convinced 'that this is indeed the next generation iPhone model." He also adds that the positioning of front camera and sensors are subject to change.
Apple's anniversary edition iPhone is said to pack a large 5.8-inch display in a form factor similar to that of the existing 4.7-inch iPhone. The device is tipped to drop the home button and instead offer a functional area serving as access point for virtual buttons. KGI Securities' Ming-Chi Kuo believes that the OLED in iPhone's active display area will be limited to 5.15-inches diagonally. Apple is also reportedly working on wireless charging technology and stacked substrate PCB design to accomodate a larger battery.
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